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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10563095 B1

PDFFull Text
Date of Patent:
Feb. 18, 2020

Filed:

Mar. 09, 2016

Adhesive composition sheet, method of producing same, and semiconductor device

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventor:

Yoichi Shinba, Otsu, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Brook Kebede

Int. Cl.
CPC ...
H01L 21/00 (2006.01); C09J 7/00 (2018.01); C09J 11/04 (2006.01); H01L 23/36 (2006.01); H01L 21/52 (2006.01); C09J 201/00 (2006.01); C09J 5/00 (2006.01); C09J 7/10 (2018.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
C09J 7/00 (2013.01); C09J 5/00 (2013.01); C09J 7/10 (2018.01); C09J 11/04 (2013.01); C09J 201/00 (2013.01); H01L 21/52 (2013.01); H01L 23/36 (2013.01); C09J 163/00 (2013.01); C09J 2201/12 (2013.01); C09J 2201/36 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2463/00 (2013.01); C09J 2479/08 (2013.01);
Abstract

Provided is an adhesive composition sheet containing an organic compound and inorganic particles, the adhesive composition sheet including a structure obtained by stacking a layer A that contains at least an organic compound and a layer B that contains an organic compound and inorganic particles, the layer A having a content rate of the organic compound larger than the content rate of the organic compound in the layer B, and the layer A and/or the layer B containing anisotropically shaped inorganic particles. The present invention provides an adhesive composition sheet excellent in thermal conductivity and insulating properties after cured.

Find Patent Forward Citations

Shinba, Yoichi. (2020). Adhesive composition sheet, method of producing same, and semiconductor device (U.S. Patent No. 10563095). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10563095

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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