The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Aug. 28, 2015
Applicant:

University of Louisville Research Foundation, Inc., Louisville, KY (US);

Inventors:

Theodore Druffel, Louisville, KY (US);

Ruvini Dharmadasa, Louisville, KY (US);

Menaka Jha, Louisville, KY (US);

Delaina Amos, Louisville, KY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/52 (2014.01); C09D 11/037 (2014.01); C09D 11/322 (2014.01); B22F 1/00 (2006.01); B22F 1/02 (2006.01); B22F 9/24 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
C09D 11/52 (2013.01); C09D 11/037 (2013.01); C09D 11/322 (2013.01); H05K 1/097 (2013.01); H05K 3/1291 (2013.01); H05K 2201/0218 (2013.01);
Abstract

Copper inks are provided that include a plurality of core-shell nanostructures, with each nanostructure including a copper core and a barrier metal shell, a diameter of less than about 500 nm, and a distinct boundary between the copper core and the barrier metal shell. Methods of forming a copper ink are further provided and include an initial step of synthesizing an amount of copper nanoparticles in an aqueous solution. An amount of a barrier metal is then added to the copper nanoparticles to form a dispersion of the barrier metal and the copper nanoparticles, and a reducing agent is subsequently added to the dispersion to produce a copper ink comprising core-shell nanostructures having a copper core and a barrier metal shell. Copper films are then formed by applying that copper ink to a substrate and sintering the copper ink.


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