The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2020
Filed:
Feb. 28, 2018
Applicant:
Fujifilm Electronic Materials U.s.a., Inc., N. Kingstown, RI (US);
Inventors:
Sanjay Malik, Attleboro, MA (US);
William A. Reinerth, Riverside, RI (US);
Binod B. De, Attleboro, MA (US);
Assignee:
Fujifilm Electronic Materials U.S.A., Inc., N. Kingstown, RI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/10 (2006.01); C08J 5/18 (2006.01); G03F 7/038 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/38 (2006.01); G03F 7/32 (2006.01); G03F 7/40 (2006.01); H01L 23/373 (2006.01); H01L 21/02 (2006.01); H01L 21/268 (2006.01); H01L 21/311 (2006.01); C08J 3/24 (2006.01); G03F 7/004 (2006.01); G03F 7/037 (2006.01); C08F 222/10 (2006.01); C09D 7/00 (2018.01); G03F 7/025 (2006.01); C08F 267/10 (2006.01); G03F 7/027 (2006.01); C09D 4/06 (2006.01); C09D 179/08 (2006.01); H01L 21/3213 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); C08K 3/36 (2006.01); C08K 5/098 (2006.01);
U.S. Cl.
CPC ...
C08G 73/1085 (2013.01); C08F 222/1006 (2013.01); C08F 267/10 (2013.01); C08G 73/101 (2013.01); C08G 73/1039 (2013.01); C08G 73/1067 (2013.01); C08G 73/1092 (2013.01); C08J 3/24 (2013.01); C08J 5/18 (2013.01); C09D 4/06 (2013.01); C09D 7/00 (2013.01); C09D 179/08 (2013.01); G03F 7/0042 (2013.01); G03F 7/0047 (2013.01); G03F 7/025 (2013.01); G03F 7/027 (2013.01); G03F 7/037 (2013.01); G03F 7/0387 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/2002 (2013.01); G03F 7/202 (2013.01); G03F 7/32 (2013.01); G03F 7/38 (2013.01); G03F 7/40 (2013.01); H01L 21/02118 (2013.01); H01L 21/02282 (2013.01); H01L 21/268 (2013.01); H01L 21/311 (2013.01); H01L 21/31127 (2013.01); H01L 21/32134 (2013.01); H01L 21/76802 (2013.01); H01L 21/76828 (2013.01); H01L 21/76865 (2013.01); H01L 21/76871 (2013.01); H01L 21/76879 (2013.01); H01L 23/3737 (2013.01); H01L 23/5226 (2013.01); H01L 23/53228 (2013.01); C08J 2379/08 (2013.01); C08K 3/36 (2013.01); C08K 5/098 (2013.01); C08K 2201/005 (2013.01); H01L 23/5329 (2013.01);
Abstract
This disclosure relates to dielectric film forming composition containing at least one fully imidized polyimide polymer; at least one inorganic filler; at least one metal-containing (meth)acrylate compound; and at least one catalyst. The dielectric film formed by such a composition can have a relatively low coefficient of thermal expansion (CTE) and a relatively high optical transparency.