The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Sep. 09, 2016
Applicant:

Massachusetts Institute of Technology, Cambridge, MA (US);

Inventors:

Jamison Go, Orlando, FL (US);

Anastasios John Hart, Waban, MA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/209 (2017.01); B33Y 30/00 (2015.01); B29C 64/20 (2017.01); B29C 64/118 (2017.01); B29C 48/02 (2019.01); B29C 48/00 (2019.01); B29C 48/285 (2019.01); B29C 48/86 (2019.01);
U.S. Cl.
CPC ...
B29C 64/209 (2017.08); B33Y 30/00 (2014.12); B29C 48/0023 (2019.02); B29C 48/02 (2019.02); B29C 48/2886 (2019.02); B29C 48/865 (2019.02); B29C 48/873 (2019.02); B29C 64/118 (2017.08); B29C 64/20 (2017.08);
Abstract

Printing devices and methods are provided that utilize high throughput extrusion to generate a printer material, such as a three-dimensional object. High-throughput extrusion systems as provided volumetrically pre-heat an extruded filament to a desired pre-heat temperature, and then either maintain or heat the extruded filament to a desired melt temperature prior to having the filament extruded out of the system and onto a surface, such as a build platform. By pre-heating the filament prior to heating it to the temperature at which it is excluded, it helps increase the throughput of the system. Likewise, by doing the heating volumetrically, it further helps increase the throughput of the system. Various embodiments of devices and methods typically used for printing in conjunction with the disclosed high throughput systems are also provided.


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