The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2020
Filed:
Feb. 15, 2018
Applicant:
Bell Helicopter Textron Inc., Fort Worth, TX (US);
Inventors:
Phillip A. Kendrick, Fort Worth, TX (US);
Levi H. Armstrong, Saginaw, TX (US);
Assignee:
Bell Helicopter Textron Inc., Fort Worth, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B26D 1/00 (2006.01); B29D 99/00 (2010.01); B29C 53/00 (2006.01); B29C 70/00 (2006.01); B26D 7/00 (2006.01); B29C 69/00 (2006.01); B32B 3/00 (2006.01); B32B 37/00 (2006.01); B26D 1/157 (2006.01); B29C 53/60 (2006.01); B29C 70/54 (2006.01); B26D 7/01 (2006.01); B26D 1/10 (2006.01); B26D 3/16 (2006.01); B26D 1/08 (2006.01); B29C 65/00 (2006.01); B32B 3/12 (2006.01); B32B 37/14 (2006.01); B29C 70/30 (2006.01);
U.S. Cl.
CPC ...
B26D 1/157 (2013.01); B26D 7/01 (2013.01); B29C 53/60 (2013.01); B29C 69/001 (2013.01); B29C 70/545 (2013.01); B29D 99/0089 (2013.01); B26D 1/08 (2013.01); B26D 1/10 (2013.01); B26D 3/167 (2013.01); B29C 66/543 (2013.01); B29C 70/30 (2013.01); B32B 3/12 (2013.01); B32B 37/146 (2013.01); Y10T 83/04 (2015.04); Y10T 83/0405 (2015.04); Y10T 83/0524 (2015.04); Y10T 156/1026 (2015.01); Y10T 156/1059 (2015.01); Y10T 156/1066 (2015.01); Y10T 156/1079 (2015.01); Y10T 156/13 (2015.01); Y10T 156/1357 (2015.01);
Abstract
A method of cutting a wafer of composite core from a bulk composite core includes stabilizing the bulk composite core with a fixture, the bulk composite core having a plurality of tube members. The method also includes cutting through each of the tube members to create the wafer while the bulk composite core is stabilized by the fixture.