The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Jun. 29, 2017
Applicant:

Medtronic, Inc., Minneapolis, MN (US);

Inventors:

Mark Breyen, Champlin, MN (US);

Tom Miltich, Otsego, MN (US);

Gordon Munns, Stacy, MN (US);

Assignee:

MEDTRONIC, INC., Minneapolis, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/375 (2006.01); B23K 35/30 (2006.01); B23K 35/32 (2006.01); B23K 101/38 (2006.01);
U.S. Cl.
CPC ...
A61N 1/3754 (2013.01); B23K 35/3013 (2013.01); B23K 35/322 (2013.01); B23K 2101/38 (2018.08); Y10T 29/49149 (2015.01);
Abstract

A method of interconnecting a conductor and a hermetic feedthrough of an implantable medical device includes welding a lead to a pad on a feedthrough. The feedthrough includes a ceramic insulator and a via hermetically bonded to the insulator. The via includes platinum. The pad is bonded to the insulator and electrically connected to the via, includes platinum, and has a thickness of at least 50 μm. The lead includes at least one of niobium, platinum, titanium, tantalum, palladium, gold, nickel, tungsten, and oxides and alloys thereof.


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