The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2020

Filed:

Feb. 26, 2018
Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventor:

Kenshi Terashima, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2006.01); H05K 1/18 (2006.01); H01R 12/58 (2011.01);
U.S. Cl.
CPC ...
H05K 1/144 (2013.01); H01L 23/49811 (2013.01); H01L 25/162 (2013.01); H05K 1/18 (2013.01); H01R 12/58 (2013.01); H05K 2201/042 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/1081 (2013.01); H05K 2201/10318 (2013.01); H05K 2201/10787 (2013.01); H05K 2201/10962 (2013.01); H05K 2201/2027 (2013.01);
Abstract

The area projections or a spacer occupies on the upper surface of a resin casing increases as the size of a power semiconductor module decreases, and therefore another means for defining a clearance between a control board and the resin casing is desired. A power semiconductor module is provided, including: a housing which houses a power semiconductor chip; and at least one control pin or guide pin which protrudes outward from an upper surface of the housing, wherein the at least one control pin or guide pin has at least one step in a height direction from the upper surface of the housing toward a tip farthest from the housing.


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