The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2020
Filed:
Jul. 25, 2019
Hongqisheng Precision Electronics (Qinhuangdao) Co.,ltd., Qinhuangdao, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Chih-Chieh Fu, New Taipei, TW;
HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Qinhuangdao, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Abstract
A circuit board includes a first wiring layer and a build-up structure. The build-up structure includes at least one dielectric layer and at least one second wiring layer. Each dielectric layer and each second wiring layer are alternately arranged. The at least one dielectric layer comprises an outermost dielectric layer. The at least one second wiring layer is formed on a side of the outermost dielectric layer, and comprises an outermost second wiring layer. A portion of the first wiring layer is embedded in a side of the outermost dielectric layer facing away the outermost second wiring layer, a remaining portion of the first wiring layer protrudes from the outermost dielectric layer. A method for manufacturing a circuit board is provided.