The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2020

Filed:

Apr. 09, 2019
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Jun Young Lim, Seoul, KR;

Woong Sik Kim, Seoul, KR;

Hyung Kyu Yoon, Seoul, KR;

Min Hwan Kim, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H05K 1/14 (2006.01); H05K 3/28 (2006.01); H05K 3/18 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0281 (2013.01); H01L 21/481 (2013.01); H01L 21/4821 (2013.01); H01L 23/4985 (2013.01); H01L 24/16 (2013.01); H05K 1/0271 (2013.01); H05K 1/144 (2013.01); H05K 3/18 (2013.01); H05K 3/28 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2924/15153 (2013.01); H05K 1/189 (2013.01); H05K 2201/055 (2013.01); H05K 2201/10128 (2013.01);
Abstract

A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.


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