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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10560066 B1

PDFFull Text
Date of Patent:
Feb. 11, 2020

Filed:

Jun. 29, 2017

Electronic component

Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventor:

Kosuke Ishida, Nagaokakyo, JP;

Assignee:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Rakesh B Patel

Int. Cl.
CPC ...
H03H 7/01 (2006.01); H01G 4/232 (2006.01); H01G 4/40 (2006.01); H01G 2/06 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01); B32B 37/00 (2006.01); H01G 4/30 (2006.01); H01L 21/48 (2006.01); H01L 23/50 (2006.01); H05K 7/10 (2006.01); H01L 23/498 (2006.01); H03H 1/00 (2006.01);
U.S. Cl.
CPC ...
H03H 7/0115 (2013.01); B32B 37/0007 (2013.01); H01F 17/0013 (2013.01); H01F 27/292 (2013.01); H01G 2/06 (2013.01); H01G 4/232 (2013.01); H01G 4/2325 (2013.01); H01G 4/30 (2013.01); H01G 4/40 (2013.01); H01L 21/4857 (2013.01); H01L 23/50 (2013.01); H05K 7/10 (2013.01); H05K 7/1038 (2013.01); B32B 2307/732 (2013.01); B32B 2457/00 (2013.01); H01F 2017/0066 (2013.01); H01L 23/49805 (2013.01); H01L 23/49822 (2013.01); H03H 2001/0085 (2013.01);
Abstract

An electronic component capable of downsizing and narrowing of a mounting space. The electronic component includes: a laminated body made up of a plurality of laminated insulator layers and having an upper surface and a bottom surface; a plurality of inner conductors disposed in the laminated body; and a plurality of terminal electrodes electrically connected to the plurality of inner conductors and exposed from the laminated body. The electronic component has a plurality of recesses formed on a bottom surface of the laminated body. The plurality of terminal electrodes includes first conductive parts formed on wall surfaces of the plurality of recesses.

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