The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2020

Filed:

Sep. 29, 2018
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Matthew D. Hill, Santa Clara, CA (US);

Michael B. Wittenberg, Sunnyvale, CA (US);

Shane Bustle, Cupertino, CA (US);

Duy P. Le, Cupertino, CA (US);

Assignee:

APPLE INC., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04M 1/02 (2006.01); G06F 1/16 (2006.01); H01Q 1/24 (2006.01); B29C 45/14 (2006.01); B29L 31/34 (2006.01); B29C 37/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/243 (2013.01); B29C 45/14311 (2013.01); B29C 45/14467 (2013.01); G06F 1/1626 (2013.01); G06F 1/1633 (2013.01); G06F 1/1656 (2013.01); H04M 1/0249 (2013.01); H04M 1/0283 (2013.01); B29C 37/0082 (2013.01); B29L 2031/34 (2013.01); B29L 2031/3437 (2013.01); G06F 2200/1633 (2013.01);
Abstract

A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.


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