The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2020
Filed:
Mar. 01, 2019
Applicant:
Samsung Display Co., Ltd., Yongin-si, Gyeonggi-Do, KR;
Inventor:
Cheol Jang, Yongin-si, KR;
Assignee:
SAMSUNG DISPLAY CO., LTD., Yongin-si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/08 (2006.01); H01L 51/00 (2006.01); B32B 5/14 (2006.01); B32B 27/08 (2006.01); H01L 27/32 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0097 (2013.01); B32B 5/145 (2013.01); B32B 27/08 (2013.01); H01L 27/323 (2013.01); H01L 27/3244 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01); B32B 2457/206 (2013.01); H01L 2251/301 (2013.01); H01L 2251/5338 (2013.01); H01L 2251/558 (2013.01); Y02E 10/549 (2013.01);
Abstract
A method of manufacturing a flexible substrate includes injecting a first reactant above a polymer substrate into a top surface of the polymer substrate and infiltrating the first reactant into the polymer substrate, injecting a second reactant below the polymer substrate into a bottom surface of the polymer substrate and infiltrating the second reactant into the polymer substrate, and forming a barrier region by filling at least a portion of a free volume of the polymer substrate with an inorganic material formed via a reaction of the first and second reactants inside the polymer substrate.