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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10559721 B1

PDFFull Text
Date of Patent:
Feb. 11, 2020

Filed:

Oct. 16, 2017

Light emitting device

Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Motokazu Yamada, Tokushima, JP;

Mototaka Inobe, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:

Global IP Counselors, LLP

Primary Examiner:

Abul Kalam

Int. Cl.
CPC ...
H01L 33/46 (2010.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 33/48 (2010.01); H01L 33/56 (2010.01); H01L 25/075 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 33/46 (2013.01); H01L 33/486 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/4945 (2013.01); H01L 2924/01322 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A light emitting device includes a substrate, a light emitting element, a light reflecting resin member, a sealing member, an electrically conductive wiring and a lens member. The light reflecting resin member surrounds the light emitting element. The sealing member is disposed in a region surrounded by the light reflecting resin member. The electrically conductive wiring is arranged on an upper surface of the substrate such that the substrate includes an exposed region exposed from the electrically conductive wiring with at least a part of the exposed region of the substrate being embedded in the light reflecting resin member. The lens member is disposed above the light emitting element to reach an outer edge of the substrate. The lens member is in contact with an upper surface of the sealing member and an upper surface and an outer lateral surface of the light reflecting resin member.

Find Patent Forward Citations

Yamada, Motokazu. (2020). Light emitting device (U.S. Patent No. 10559721). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10559721

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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