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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10559554 B1

PDFFull Text
Date of Patent:
Feb. 11, 2020

Filed:

Aug. 01, 2017

Method for fabricating led module using transfer tape

Applicant:

Lumens Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Taekyung Yoo, Yongin-si, KR;

Daewon Kim, Yongin-si, KR;

Jinmo Kim, Yongin-si, KR;

Jinwon Choi, Yongin-si, KR;

Jimin Her, Yongin-si, KR;

Younghwan Shin, Yongin-si, KR;

Sol Han, Yongin-si, KR;

Kyujin Lee, Yongin-si, KR;

Assignee:

LUMENS CO., LTD., Yongin-si, KR;

Attorney:

Mei & Mark LLP

Primary Examiner:

Robert T Huber

Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 33/62 (2010.01); H01L 33/00 (2010.01); H01L 23/00 (2006.01); H01L 33/60 (2010.01); H01L 21/677 (2006.01); H01L 27/15 (2006.01); H01L 33/36 (2010.01); H01L 33/08 (2010.01); H01L 33/06 (2010.01); H01L 33/32 (2010.01); H01L 33/30 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 21/677 (2013.01); H01L 21/67144 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 24/81 (2013.01); H01L 24/97 (2013.01); H01L 25/075 (2013.01); H01L 27/15 (2013.01); H01L 33/00 (2013.01); H01L 33/007 (2013.01); H01L 33/0075 (2013.01); H01L 33/0079 (2013.01); H01L 33/36 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H05K 999/99 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 33/06 (2013.01); H01L 33/08 (2013.01); H01L 33/30 (2013.01); H01L 33/32 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2221/68395 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/8121 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/95001 (2013.01); H01L 2224/9511 (2013.01); H01L 2224/95115 (2013.01); H01L 2224/95136 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0066 (2013.01);
Abstract

Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

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