The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2020
Filed:
Jan. 10, 2019
Sumco Corporation, Tokyo, JP;
Yasuyuki Morikawa, Tokyo, JP;
SUMCO CORPORATION, Tokyo, JP;
Abstract
Disclosed is a method of manufacturing a bonded wafer, wherein a terrace forming step is carried out using a chamfering wheel which comprise a low grit number grinding stone and a high grit number grinding stone having a higher grit number than the low grit number grinding stone, and wherein the terrace forming step comprises: a coarse chamfering step of chamfering, after chamfering the active layer wafer, the insulating film from the active layer wafer side and further chamfering the support substrate wafer, using the low grit number grinding stone; and a finish chamfering step of finish chamfering, after the coarse chamfering step, a machined surface obtained from the coarse chamfering step, using the high grit number grinding stone.