The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2020

Filed:

Apr. 07, 2017
Applicant:

SK Hynix Inc., Icheon-Si, KR;

Inventors:

Ga-Young Ha, Icheon-si, KR;

Ki-Seon Park, Seoul, KR;

Jong-Han Shin, Seoul, KR;

Jeong-Myeong Kim, Hwaseong-si, KR;

Bo-Kyung Jung, Cheongju-si, KR;

Assignee:

SK hynix Inc., Icheon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 41/30 (2006.01); H01F 10/32 (2006.01); H01F 41/32 (2006.01); H01L 43/08 (2006.01); H01L 43/12 (2006.01); G01R 33/09 (2006.01); G11B 5/39 (2006.01);
U.S. Cl.
CPC ...
H01F 41/307 (2013.01); G01R 33/098 (2013.01); G11B 5/3909 (2013.01); H01F 10/3231 (2013.01); H01F 41/32 (2013.01); H01L 43/08 (2013.01); H01L 43/12 (2013.01); H01F 10/3254 (2013.01); H01F 10/3286 (2013.01);
Abstract

A method for fabricating an electronic device including a semiconductor memory includes: forming a variable resistance element over a substrate, the variable resistance element including a metal-containing layer and an MTJ (Magnetic Tunnel Junction) structure which is located over the metal-containing layer and includes a free layer having a variable magnetization direction, a pinned layer having a fixed magnetization direction and a tunnel barrier layer interposed between the free layer and the pinned layer; forming an initial spacer containing a metal over the variable resistance element; performing an oxidation process to transform the initial spacer into a middle spacer including an insulating metal oxide; and performing a treatment using a gas or plasma including nitrogen and hydrogen to transform the middle spacer produced by the oxidation process into a final spacer including an insulating metal nitride or an insulating metal oxynitride.


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