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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10559409 B1

PDFFull Text
Date of Patent:
Feb. 11, 2020

Filed:

Mar. 25, 2019

Process for manufacturing a leadless feedthrough for an active implantable medical device

Applicant:

Greatbatch Ltd., Clarence, NY (US);

Inventors:

Keith W. Seitz, Clarence Center, NY (US);

Dallas J. Rensel, Sanborn, NY (US);

Brian P. Hohl, Clarence, NY (US);

Jonathan Calamel, Williamsville, NY (US);

Xiaohong Tang, Williamsville, NY (US);

Robert A. Stevenson, Canyon County, CA (US);

Christine A. Frysz, Orchard Park, NY (US);

Thomas Marzano, East Amherst, NY (US);

Jason Woods, Carson City, NV (US);

Richard L. Brendel, Carson City, NV (US);

Assignee:

Greatbatch Ltd., Clarence, NY (US);

Attorney:

Michael F. Scalise

Primary Examiner:

Devang R Patel

Int. Cl.
CPC ...
A61N 1/375 (2006.01); B23K 1/19 (2006.01); C04B 41/51 (2006.01); H01B 17/30 (2006.01); C04B 41/45 (2006.01); C04B 41/88 (2006.01); H01B 19/02 (2006.01); B23K 1/00 (2006.01); C04B 41/00 (2006.01); B23K 1/008 (2006.01); B23K 26/32 (2014.01); B23K 26/21 (2014.01); B22F 7/04 (2006.01); B23K 101/36 (2006.01); B23K 103/14 (2006.01); B22F 7/08 (2006.01);
U.S. Cl.
CPC ...
H01B 17/30 (2013.01); A61N 1/3754 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 1/19 (2013.01); B23K 26/21 (2015.10); B23K 26/32 (2013.01); C04B 41/0072 (2013.01); C04B 41/4578 (2013.01); C04B 41/5122 (2013.01); C04B 41/5177 (2013.01); C04B 41/5194 (2013.01); C04B 41/88 (2013.01); H01B 19/02 (2013.01); B22F 7/04 (2013.01); B22F 7/08 (2013.01); B23K 2101/36 (2018.08); B23K 2103/14 (2018.08);
Abstract

A method for manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of first forming a ceramic reinforced metal composite (CRMC) paste by mixing platinum with a ceramic material to form a CRMC material, subjecting the CRMC material to a first sintering step to thereby form a sintered CRMC material, ball-milling or grinding the sintered CRMC material to form a powdered CRMC material; and then mixing the powdered CRMC material with a solvent to form the CRMC paste. The method further includes forming an alumina ceramic body in a green state, forming at least one via hole through the alumina ceramic body, filling the via hole with the CRMC paste, drying the ceramic body including the CRMC paste to form a first CRMC material filling the via hole, forming a second via hole through the first CRMC material, providing a metal core in the second via hole, and subjecting the ceramic body including the first CRMC material and the metal core to a second sintering step to thereby form the dielectric body. The dielectric body is then sealed in a ferrule opening to form a feedthrough.

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