The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2020

Filed:

Jun. 30, 2017
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Thomas J. Longo, Redmond, WA (US);

Scott D. Bowers, Woodinville, WA (US);

Yazan Aldehayyat, Seattle, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/01 (2006.01); G06F 3/0354 (2013.01); G06F 3/02 (2006.01);
U.S. Cl.
CPC ...
G06F 3/016 (2013.01); G06F 3/0202 (2013.01); G06F 3/03547 (2013.01);
Abstract

Aspects described herein generally relate to a haptic feedback mechanism including a shape memory alloy (SMA) material coupled to a mass and a surface, where contraction of the SMA material causes the mass to move from a first position to a second position causing one of compression or decompression of a spring element coupled to the mass, and where loosening of the SMA material causes the mass the move from the second position toward the first position by the other one of compression or decompression of the spring element. The haptic feedback mechanism also includes a heat source configured to selectively apply heat to, and remove heat from, the SMA material to achieve a modulation of contracting and loosening of the SMA material to cause a vibration of the mass.


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