The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2020
Filed:
Apr. 26, 2017
Applicant:
Yazaki Corporation, Tokyo, JP;
Inventor:
Yoshitaka Ito, Shizuoka, JP;
Assignee:
YAZAKI CORPORATION, Minato-ku, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); C23C 18/31 (2006.01); H01R 13/03 (2006.01); C25D 5/12 (2006.01); C23C 28/02 (2006.01); C23C 18/16 (2006.01);
U.S. Cl.
CPC ...
C23C 18/31 (2013.01); C23C 18/165 (2013.01); C23C 18/1637 (2013.01); C23C 28/021 (2013.01); C23C 28/023 (2013.01); C25D 5/12 (2013.01); H01R 13/03 (2013.01); Y10T 428/12896 (2015.01); Y10T 428/12944 (2015.01);
Abstract
A plated material includes a base metal made from Cu or an alloy containing Cu as a main raw material, an underlayer made from Ni formed on the base metal, and an Ag plated layer formed on the underlayer. A thickness of the underlayer is 0.1 μm to 1.0 μm. A thickness of the Ag plated layer is 1.0 μm or less.