The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2020

Filed:

Sep. 25, 2017
Applicant:

Jx Nippon Mining & Metals Corporation, Tokyo, JP;

Inventors:

Kenichi Nagata, Ibaraki, JP;

Nobuhito Makino, Ibaraki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); H01J 37/34 (2006.01); C21D 1/74 (2006.01); C21D 3/06 (2006.01); C22C 14/00 (2006.01); C22F 1/00 (2006.01); C22F 1/18 (2006.01); C22C 27/02 (2006.01);
U.S. Cl.
CPC ...
C23C 14/34 (2013.01); C21D 1/74 (2013.01); C21D 3/06 (2013.01); C22C 14/00 (2013.01); C22C 27/02 (2013.01); C22F 1/00 (2013.01); C22F 1/18 (2013.01); C22F 1/183 (2013.01); C23C 14/3414 (2013.01); C23C 14/3471 (2013.01); H01J 37/3426 (2013.01); H01J 37/3464 (2013.01); H01J 37/3491 (2013.01); H01J 37/3497 (2013.01); Y10T 29/49865 (2015.01);
Abstract

A sputtering target and/or a coil disposed at a periphery of a plasma-generating region for confining plasma are provided. The target and/or coil has a surface to be eroded having a hydrogen content of 500 μL/cmor less. In dealing with reduction in hydrogen content of the surface of the target and/or coil, a process of producing the target and/or coil, in particular, conditions for heating the surface of the target and/or coil, which is believed to be a cause of hydrogen occlusion, are appropriately regulated. As a result, hydrogen occlusion at the surface of the target can be reduced, and the degree of vacuum during sputtering can be improved. Thus, a target and/or coil is provided that has a uniform and fine structure, makes plasma stable, and allows a film to be formed with excellent uniformity. A method of producing the target and/or the coil is also provided.


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