The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2020
Filed:
Feb. 13, 2019
Mitsubishi Shindoh Co., Ltd., Tokyo, JP;
Keiichiro Oishi, Osaka, JP;
Kouichi Suzaki, Osaka, JP;
Shinji Tanaka, Osaka, JP;
Takayuki Oka, Osaka, JP;
Mitsubishi Shindoh Co., Ltd., Tokyo, JP;
Abstract
This free-cutting copper alloy contains 75.0%-78.5% Cu, 2.95%-3.55% Si, 0.07%-0.28% Sn, 0.06%-0.14% P, and 0.022%-0.25% Pb, with the remainder being made up of Zn and inevitable impurities. The composition satisfies the following relations: 76.2≤f1=Cu+0.8×Si−8.5×Sn+P+0.5×Pb≤80.3, 61.5≤f2=Cu−4.3×Si−0.7×Sn−P+0.5×Pb≤63.3. The area ratios (%) of the constituent phases satisfy the following relations: 25≤κ≤65, 0≤γ≤1.5, 0≤β≤0.2, 0≤μ≤2.0, 97.0≤f3=α+κ, 99.4≤f4=α+κ+γ+μ, 0≤f5=γ+μ≤2.5, 27≤f6=κ+6×γ+0.5×μ≤70. The long side of the γ phase does not exceed 40 μm, the long side of the μ phase does not exceed 25 μm, and the κ phase is present within the α phase.