The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2020

Filed:

Dec. 20, 2012
Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Yuki Komatsuzaki, Saitama, JP;

Takeshi Iwasaki, Saitama, JP;

Hideaki Takei, Saitama, JP;

Assignee:

DIC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/26 (2018.01);
U.S. Cl.
CPC ...
C09J 7/26 (2018.01); C08J 2205/04 (2013.01); C08J 2323/02 (2013.01); C09J 2201/122 (2013.01); C09J 2201/622 (2013.01); C09J 2203/326 (2013.01); C09J 2423/006 (2013.01); Y10T 428/249978 (2015.04);
Abstract

An adhesive tape including a particular foam base is provided. An average bubble diameter in a machine direction (MD) and an average bubble diameter in a cross-machine direction (CD) of the foam base are each 150 μm or less, the ratio of the average bubble diameter in the machine direction/an average bubble diameter in a vertical direction (VD) and the ratio of the average bubble diameter in the cross-machine direction/the average bubble diameter in the vertical direction are each 6 or less, and the foam base has an interlaminar strength of 20 N/cm or more. With this adhesive tape, good followability to an adherend and excellent impact resistance can be realized. The adhesive tape of the present invention can be suitably used in portable electronic devices, such as smartphones, tablets, notebooks, and game machines, whose screen size has been increasing and for which a requirement for flexible design is high.


Find Patent Forward Citations

Loading…