The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2020

Filed:

Nov. 30, 2015
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Takuya Sonoyama, Fujimi-machi, JP;

Koji Imamura, Shiojiri, JP;

Shotaro Watanabe, Suwa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/03 (2014.01); C09D 11/50 (2014.01); C09D 11/106 (2014.01); C09D 11/36 (2014.01); C09D 11/38 (2014.01); C09D 11/52 (2014.01); H01L 51/00 (2006.01); G02B 5/20 (2006.01); C09D 11/033 (2014.01); H05B 33/22 (2006.01); H01L 51/50 (2006.01); H05B 33/10 (2006.01); B05D 7/24 (2006.01); H05B 33/12 (2006.01); C09D 11/102 (2014.01); C09D 11/30 (2014.01); C23C 14/06 (2006.01); H01L 27/32 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
C09D 11/033 (2013.01); B05D 7/24 (2013.01); C09D 11/102 (2013.01); C09D 11/30 (2013.01); C09D 11/36 (2013.01); C09D 11/38 (2013.01); C09D 11/50 (2013.01); C09D 11/52 (2013.01); C23C 14/06 (2013.01); G02B 5/20 (2013.01); H01L 27/322 (2013.01); H01L 27/3244 (2013.01); H01L 51/0005 (2013.01); H01L 51/0007 (2013.01); H01L 51/0012 (2013.01); H01L 51/0026 (2013.01); H01L 51/0039 (2013.01); H01L 51/50 (2013.01); H01L 51/56 (2013.01); H05B 33/10 (2013.01); H05B 33/12 (2013.01); H05B 33/22 (2013.01); H01L 51/5012 (2013.01); H01L 51/5056 (2013.01);
Abstract

To provide a film-forming ink and a film formation method, capable of making the dimensional accuracy of a film to be formed excellent by increasing the apparent liquid droplet amount of a film-forming ink to be supplied as a liquid droplet into an opening part included in a partition wall, and also to provide a device with a film and an electronic apparatus, each of which has a film formed using the film formation method. A film-forming ink of the invention includes a film-forming material and a liquid medium in which the film-forming material is dissolved or dispersed, wherein the liquid medium contains a first component which has a boiling point at an atmospheric pressure of 200° C. or higher and a second component which has a boiling point at an atmospheric pressure lower than the first component.


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