The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2020
Filed:
Jul. 21, 2016
Applicant:
Sabic Global Technologies B.v., Bergen op Zoom, NL;
Inventors:
Jian Wang, Shanghai, CN;
Shijie Song, Shanghai, CN;
Assignee:
SABIC Global Technologies B.V., Bergen op Zoom, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 71/12 (2006.01); C08L 25/06 (2006.01); C08L 53/02 (2006.01); C08K 3/22 (2006.01); B29C 48/00 (2019.01); C08K 3/014 (2018.01); C08K 3/30 (2006.01);
U.S. Cl.
CPC ...
C08L 71/12 (2013.01); B29C 48/022 (2019.02); C08K 3/014 (2018.01); C08K 3/22 (2013.01); C08K 3/30 (2013.01); C08L 25/06 (2013.01); C08L 53/02 (2013.01); C08K 2003/2241 (2013.01); C08L 2203/20 (2013.01);
Abstract
Disclosed are resin compositions that include poly(arylene ether), HIPS/GPPS), impact modifier, and ceramic filer that provide various Dk values while maintaining Df at a very low level. The compositions also possess excellent mechanical and processing performance, for example, superior high impact strength and good ductility, compared to prior art compositions. The compositions can be used to form components of wireless electronic communications devices in order to ensure a low degree of signal attenuation.