The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2020

Filed:

Dec. 09, 2016
Applicant:

Elite Material Co., Ltd., Taoyuan, TW;

Inventor:

Shu-Hao Chang, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08G 59/50 (2006.01); C08J 5/24 (2006.01); D06M 15/53 (2006.01); D06M 15/55 (2006.01); D06M 15/61 (2006.01); D06M 15/693 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/504 (2013.01); C08J 5/24 (2013.01); D06M 15/53 (2013.01); D06M 15/55 (2013.01); D06M 15/61 (2013.01); D06M 15/693 (2013.01); C08J 2363/00 (2013.01); C08J 2409/02 (2013.01); C08J 2415/00 (2013.01); C08J 2463/04 (2013.01); C08J 2471/02 (2013.01); C08L 2205/02 (2013.01); C08L 2205/03 (2013.01);
Abstract

The disclosure relates to a resin composition, comprising an epoxy resin, a high molecular weight polyetheramine and an amine-terminated acrylonitrile rubber. Various products can be made from the resin composition, such as prepregs, laminates, printed circuit boards or rigid-flex boards, in which one, multiple or all of the following properties can be met: low resin flow, low dust weight loss, high peel strength at room temperature and at high temperature, low moisture absorption rate, and better varnish stability.


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