The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2020

Filed:

Oct. 12, 2012
Applicant:

Digital Sensing Limited, Auckland, NZ;

Inventors:

Andrew Haynes, Auckland, NZ;

David James Bates, Auckland, NZ;

Ashton Cyril Partridge, Auckland, NZ;

Karthik Kannappan, Auckland, NZ;

Assignee:

Digital Sensing Limited, Auckland, NZ;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/30 (2006.01); B05D 5/00 (2006.01); C25D 1/00 (2006.01); G01N 27/327 (2006.01);
U.S. Cl.
CPC ...
B32B 3/30 (2013.01); B05D 5/00 (2013.01); C25D 1/003 (2013.01); G01N 27/3275 (2013.01); B32B 2307/202 (2013.01); Y10T 428/24612 (2015.01);
Abstract

The invention relates to a microarray structure including a substrate material layer, a continuous three-dimensional (3D) surface layer on the substrate material layer that is capable of functionalisation for use as an array, and an inert material wherein the structure includes accurately defined and functionalisable isolated areas which are millimeter to nanometer in size. The functionalised areas are part of the continuous 3D surface layer and are isolated by the inert material and are interconnected within the structure by the continuous 3D surface layer.


Find Patent Forward Citations

Loading…