The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2020
Filed:
Aug. 30, 2011
Toshikazu Nanbu, Machida, JP;
Kenji Miyamoto, Yokosuka, JP;
Masayuki Inoue, Yokohama, JP;
Chika Yamamoto, Tokyo, JP;
Yoshitaka Uehara, Yokohama, JP;
Akio Hirose, Ibaraki, JP;
Toshikazu Nanbu, Machida, JP;
Kenji Miyamoto, Yokosuka, JP;
Masayuki Inoue, Yokohama, JP;
Chika Yamamoto, Tokyo, JP;
Yoshitaka Uehara, Yokohama, JP;
Akio Hirose, Ibaraki, JP;
Nissan Motor Co., Ltd., Yokohama-shi, Kanagawa, JP;
Abstract
An inexpensive bonding method is provided to bond materials constituted of an aluminum-based metal to each other at a low temperature and a low pressure while inhibiting deformation, without requiring the use of a flux and minimizing the influence on the base materials and the periphery. Also provided are various bonded parts obtained by the bonding method. An insert material comprising Zn as an element that undergoes a eutectic reaction with Al is interposed between two materials constituted of an aluminum-based metal. The two materials are heated, while being pressed against each other, to a temperature at which the eutectic reaction takes place, thereby generating, at the bonding interface between the two materials, a melt due to the eutectic reaction with some of the Al contained in the base materials and discharging the Al oxide films from the bonding interface together with the melt. Thus, the two materials are bonded.