The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Jun. 01, 2016
Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, Tokyo, JP;

Inventors:

Hidetoshi Kitanaka, Tokyo, JP;

Hiroki Kawamoto, Tokyo, JP;

Assignee:

MITSUBISHI ELECTRIC CORPORATION, Chiyoda-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 7/20 (2006.01); H02M 7/04 (2006.01); H02M 7/48 (2007.01); H02M 7/00 (2006.01); H01L 23/467 (2006.01); H02M 3/335 (2006.01); H02M 7/5387 (2007.01);
U.S. Cl.
CPC ...
H05K 7/20909 (2013.01); H01L 23/467 (2013.01); H02M 3/33569 (2013.01); H02M 7/003 (2013.01); H02M 7/04 (2013.01); H02M 7/48 (2013.01); H02M 7/53871 (2013.01); H05K 7/20154 (2013.01); H05K 7/20172 (2013.01); H05K 7/20209 (2013.01); H05K 7/20863 (2013.01); H05K 7/20918 (2013.01); H05K 7/20945 (2013.01);
Abstract

An inside of a housing of a power conversion device is partitioned by partitioning walls, and the power conversion device is configured from: an open part, into which external air flows; a first airtight part that is adjacent to the open part and into which no external air flows; and a second airtight part that is adjacent to the first airtight part and into which external air does not flow. At least two ventilation holes are formed in a partition wall between the first airtight part and the second airtight part. A circulation fan is provided to at least one of the at least two ventilation holes. The outer surface of the first airtight part is provided with a heatsink that dissipates heat transferred from an electronic component placed in the first airtight part, the heatsink being exposed to the open part.


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