The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2020
Filed:
Oct. 24, 2018
Applicant:
Chiun Mai Communication Systems, Inc., New Taipei, TW;
Inventor:
Yu-Wei Chang, New Taipei, TW;
Assignee:
Chiun Mai Communication Systems, Inc., New Taipei, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); C09K 5/04 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20336 (2013.01); C09K 5/04 (2013.01); H05K 7/20309 (2013.01); H05K 7/20318 (2013.01);
Abstract
A heat dissipation structure comprises a channel structure and a cooling material received and sealed in the channel structure. The cooling material is a low-boiling-point electrical insulating fluid. The channel structure is made of an electrical insulating material. The channel structure comprises an evaporation portion, a condenser portion, and at least one channel connecting the evaporation portion and the condenser portion. An electronic device using the heat dissipation structure is also provided.