The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2020
Filed:
Jan. 12, 2018
Murata Manufacturing Co., Ltd., Kyoto, JP;
Masashi Yamaura, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A component module includes a circuit board having a first base, a second base facing the first base, and a side section connected to the first and second bases. A wiring pattern is formed on at least one of a first facing surface of the first base that faces the second base, a second facing surface of the second base that faces the first base, and a side section facing surface of the side section that faces a direction in which the first and second bases extend. The component module further includes an electronic component that is in contact with at least one of the first facing surface, the second facing surface, and the side section facing surface. A sealing resin is formed in a region surrounded by the first facing surface, the second facing surface, and the side section facing surface so as to seal the electronic component.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile