The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Jun. 15, 2018
Applicant:

GM Global Technology Operations Llc, Detroit, MI (US);

Inventors:

Bassam S. Shahmurad, Rochester Hills, MI (US);

Walter A. Kargus, IV, Livonia, MI (US);

Stephen M. Sifton, Macomb Township, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/08 (2006.01); H04R 1/40 (2006.01); H04R 17/02 (2006.01);
U.S. Cl.
CPC ...
H04R 1/086 (2013.01); H04R 1/406 (2013.01); H04R 17/02 (2013.01); H04R 2410/07 (2013.01); H04R 2499/13 (2013.01);
Abstract

A microphone assembly includes a base that includes a first surface, a second surface and a third surface. The first surface is configured to connect the base to a mounting location in an external environment. The second surface is positioned parallel to the first surface with the third surface positioned therebetween. The third surface defines a curved shape to direct air flow that contacts the third surface in a direction away from the first surface. The microphone assembly also includes a cap disposed over and separated from the base by a gap. The cap includes a domed portion that has a convex shape that curves away from the second surface of the base. The microphone assembly also includes a microphone array that includes a plurality of microphones. The microphone array is disposed within the cap and is configured to receive acoustic signals from the external environment through the gap.


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