The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Dec. 26, 2018
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;

Inventors:

Keiju Yamada, Yokohama Kanagawa, JP;

Makoto Sano, Kawasaki Kanagawa, JP;

Koh Hashimoto, Yokohama Kanagawa, JP;

Makoto Higaki, Setagaya Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 13/10 (2006.01); H01Q 1/22 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01Q 1/24 (2006.01);
U.S. Cl.
CPC ...
H01Q 13/10 (2013.01); H01L 23/3114 (2013.01); H01L 23/49534 (2013.01); H01L 23/49541 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/24 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01);
Abstract

According to an embodiment, a wireless device includes an interposer, a semiconductor chip, electrodes, and a slot antenna. The interposer includes conductive layers disposed at least at a side of a component mounting surface and a side of a reverse surface opposite to the component mounting surface. The semiconductor chip is mounted on the component mounting surface and includes a built-in transceiving circuit. The electrodes are disposed in a conductive layer disposed at the side of the reverse surface of the interposer so as to be electrically connected to an outside of the wireless device. At least a portion of the slot antenna is disposed in at least one of the conductive layers of the interposer. A shortest distance between an end in a width direction of the slot antenna and the electrodes is smaller than a sum of a minimum line width and a minimum line space of the interposer.


Find Patent Forward Citations

Loading…