The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2020
Filed:
Mar. 13, 2017
Zeon Corporation, Chiyoda-ku, Tokyo, JP;
Daido Chiba, Tokyo, JP;
Teiji Kohara, Tokyo, JP;
ZEON CORPORATION, Chiyoda-ku, Tokyo, JP;
Abstract
The invention is a method for manufacturing an organic electronic device sealing body, adhesively integrating an organic electronic device with a sheet-like sealant made of a modified hydrocarbon-based soft resin having an alkoxysilyl group, the method comprising steps of: step [1]: laminating the organic electronic device and the sheet-like sealant to obtain a laminate; step [2]: putting the resulting laminate into a resin bag, degassing the bag, and then sealing the bag containing the laminate; and step [3]: placing the sealed bag under a pressure of 0.1 MPa or higher to adhesively integrate the laminate. One aspect of the invention provides a method for manufacturing an organic electronic device sealing body which allows industrially-advantageous sealing of the organic electronic device including organic functional elements such as an organic EL element and an organic semiconductor element.