The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Jul. 13, 2016
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Lutz Hoeppel, Alteglofsheim, DE;

Attila Molnar, Gelugor, MY;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/22 (2010.01); H01L 33/00 (2010.01); H01L 33/38 (2010.01); H01L 33/44 (2010.01); H01L 33/32 (2010.01);
U.S. Cl.
CPC ...
H01L 33/22 (2013.01); H01L 33/007 (2013.01); H01L 33/0079 (2013.01); H01L 33/0095 (2013.01); H01L 33/32 (2013.01); H01L 33/382 (2013.01); H01L 33/44 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01);
Abstract

The invention relates, inter alia, to a method for producing a plurality of semiconductor chips, the method comprising the following steps: providing a substrate (); applying a semiconductor layer sequence () to the substrate (); generating a plurality of recesses () in the semiconductor layer sequence () on the side of the semiconductor layer sequence () that is facing away from the substrate (); detaching the substrate () from the semiconductor layer sequence (); thinning the semiconductor layer sequence () on the side that was facing the substrate () prior to detaching the substrate ().


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