The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2020
Filed:
Jul. 27, 2016
Applicant:
Renesas Electronics Corporation, Tokyo, JP;
Inventors:
Yosuke Katsura, Gunma, JP;
Yusuke Tanuma, Tokyo, JP;
Assignee:
Renesas Electronics Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/18 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 21/4853 (2013.01); H01L 21/563 (2013.01); H01L 25/18 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1436 (2013.01);
Abstract
A semiconductor device includes a memory component, which is a semiconductor component (a semiconductor chip or a semiconductor package), to be mounted over an upper surface of a wiring substrate. In addition, in the upper surface, a distance between the memory component and a first substrate side of the upper surface is smaller than a distance between the memory component and a second substrate side of the upper surface. In addition, in the upper surface, a dam portion is formed between the memory component and the first substrate side.