The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Nov. 29, 2017
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventors:

Donald Joseph Leahy, Kernersville, NC (US);

James E. Culler, Jr., Lexington, NC (US);

Thomas Scott Morris, Lewisville, NC (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/3205 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 23/48 (2006.01); H01L 21/288 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/288 (2013.01); H01L 21/2885 (2013.01); H01L 21/32051 (2013.01); H01L 21/561 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 23/481 (2013.01); H01L 23/3121 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01);
Abstract

The present disclosure provides electromagnetic shielding for integrated circuit modules with a module-bottom sealing procedure. First a precursor package with a number of integrated modules is provided. Each integrated module includes a module substrate having a number of module contacts at a bottom surface of the module substrate. A combination of a shielding protective material and a chemical resistant tape is then applied over the bottom surface of the module substrate, such that each module contact is sealed. Next, the precursor package is singulated at each inter-module area to form a number of individual integrated modules. A shielding structure is applied completely over a side surface of each individual integrated module. Herein, the shielding structure is electrically coupled to a ground plane within the module substrate.


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