The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

May. 12, 2016
Applicant:

Ampleon Netherlands B.v., AV Nijmegen, NL;

Inventors:

Vittorio Cuoco, AV Nijmegen, NL;

Youri Volkhine, AV Nijmegen, NL;

Yi Zhu, AV Nijmegen, NL;

Josephus Van Der Zanden, AV Nijmegen, NL;

Anna Walesieniuk, AV Nijmegen, NL;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H03H 7/38 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H03H 7/38 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6666 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48157 (2013.01); H01L 2224/48195 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/49112 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/19107 (2013.01);
Abstract

An integrated circuit package is provided. The integrated circuit package comprises a first and second guard bond wire. The first guard bond wire has a first and second end coupled to ground. The second guard bond wire has a first and second end coupled to ground. The integrated circuit package further comprises a die. The die is mounted between the first and second guard bond wires such that the first and second guard bond wires distort a magnetic field between at least an input terminal and an output terminal of the die.


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