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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10553537 B1

PDFFull Text
Date of Patent:
Feb. 04, 2020

Filed:

Feb. 17, 2018

Interconnects containing serpentine line structures for three-dimensional memory devices and methods of making the same

Applicant:

Sandisk Technologies Llc, Plano, TX (US);

Inventors:

Yuji Takahashi, San Jose, CA (US);

Chenche Huang, Campbell, CA (US);

Chun-Ming Wang, Fremont, CA (US);

Vincent Shih, San Jose, CA (US);

Assignee:

SANDISK TECHNOLOGIES LLC, Addison, TX (US);

Attorney:

The Marbury Law Group, PLLC

Primary Examiner:

Jonathan Han

Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 27/11556 (2017.01); H01L 27/11582 (2017.01); H01L 27/24 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01); H01L 27/11556 (2013.01); H01L 27/11582 (2013.01); H01L 27/2481 (2013.01);
Abstract

A device structure includes an array of semiconductor devices located in an array region over a substrate, metal lines laterally extending from the device region to a peripheral interconnection region, and interconnect via structures located in the peripheral interconnection region, and contacting a portion of a respective one of the plurality of metal lines. The metal lines include a first metal line and a second metal line each having a serpentine region which contacts a respective interconnect via structure.

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Quick Actions:

Takahashi, Yuji. (2020). Interconnects containing serpentine line structures for three-dimensional memory devices and methods of making the same (U.S. Patent No. 10553537). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10553537

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