The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2020
Filed:
Sep. 20, 2017
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Chao Song, San Diego, CA (US);
Xuhao Huang, San Diego, CA (US);
Marzio Pedrali-Noy, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01P 1/203 (2006.01); H05K 3/30 (2006.01); H01L 21/74 (2006.01); H01L 21/82 (2006.01); H01L 27/01 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5223 (2013.01); H01L 21/743 (2013.01); H01L 21/82 (2013.01); H01L 23/5222 (2013.01); H01L 23/5228 (2013.01); H01L 27/016 (2013.01); H01L 28/20 (2013.01); H01L 28/86 (2013.01); H01P 1/20336 (2013.01); H05K 3/303 (2013.01); H01L 2224/05085 (2013.01);
Abstract
A process-invariant RC circuit is formed by patterning a metal layer using the same mask pattern to form a metal layer resistor and a metal layer capacitor. The same mask pattern results in the metal layer resistor and the metal layer capacitor each having a plurality of longitudinally-extending fingers having the same width and separation.