The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2020
Filed:
Aug. 08, 2018
Microchip Technology Incorporated, Chandler, AZ (US);
Man Kit Lam, Colorado Springs, CO (US);
Microchip Technology Incorporated, Chandler, AZ (US);
Abstract
An integrated circuit (IC) package, e.g., a power MOSFET package, may include a lead frame including (a) a main lead frame structure including a plurality of leads and defining or lying in a main lead frame plane, and (b) an offset lead frame die-attach pad (DAP) defining or lying in an offset plane that is offset from the main lead frame plane. The power IC package may further include a semiconductor die having a first side attached to the offset lead frame DAP, and a conductive element attached to both (a) a second side of the semiconductor die and (b) the main lead frame structure. The lead frame including the offset DAP may emulate the functionality of a copper clip, thus eliminating the need for the copper clip. The power IC package may also exhibit enhanced heat dissipation capabilities.