The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2020
Filed:
Apr. 04, 2016
Applicant:
Sony Interactive Entertainment Inc., Tokyo, JP;
Inventors:
Hitomi Iizuka, Tokyo, JP;
Hiroaki Tsurumi, Tokyo, JP;
Shinya Tsuchida, Tokyo, JP;
Kenji Hirose, Tokyo, JP;
Yuta Tamaki, Chiba, JP;
Assignee:
Sony Interactive Entertainment Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/40 (2006.01); A63F 13/90 (2014.01); H01L 23/433 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); A63F 13/90 (2014.09); H01L 23/433 (2013.01); H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H05K 9/0033 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4037 (2013.01); H01L 2023/4062 (2013.01); H01L 2023/4068 (2013.01); H01L 2023/4087 (2013.01); H05K 2201/066 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/10265 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10409 (2013.01);
Abstract
A leaf spring is disposed between a circuit board and a upper shield. The leaf spring biases a heat sink toward the circuit board through a connecting member. The leaf spring is not electrically connected to the upper shield. According to this structure, an integrated circuit and the heat sink can be contacted with each other with certainty. Further, generation of unnecessary radiation can be suppressed effectively.