The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Jun. 22, 2018
Applicants:

Jeroen Bosboom, St. Petersburg, FL (US);

Babak Naderi, St. Petersburg, FL (US);

George Kovatchev, St. Petersburg, FL (US);

Payman Rahimi, St. Petersburg, FL (US);

Kwok Kuen Yu, St. Petersburg, FL (US);

Inventors:

Jeroen Bosboom, St. Petersburg, FL (US);

Babak Naderi, St. Petersburg, FL (US);

George Kovatchev, St. Petersburg, FL (US);

Payman Rahimi, St. Petersburg, FL (US);

Kwok Kuen Yu, St. Petersburg, FL (US);

Assignee:

JABIL INC., St. Petersburg, FL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B65G 49/07 (2006.01); B66C 1/02 (2006.01); H01L 21/687 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68707 (2013.01); H01L 21/67265 (2013.01); H01L 21/67718 (2013.01); H01L 21/68 (2013.01); H01L 21/6838 (2013.01);
Abstract

An apparatus, system and method for providing a Bernoulli-based wafer pre-aligner. The pre-aligner may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; and a plurality of Bernoulli pads on the wafer support for providing an interface between the wafer support and a one of the semiconductor wafers, wherein the interface comprises a gap there between.


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