The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Apr. 20, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Xinhai Han, Santa Clara, CA (US);

Kang Sub Yim, Palo Alto, CA (US);

Zhijun Jiang, Sunnyvale, CA (US);

Deenesh Padhi, Sunnyvale, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/40 (2006.01); C23C 16/24 (2006.01); C23C 16/505 (2006.01); C23C 28/00 (2006.01); C23C 28/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0262 (2013.01); C23C 16/24 (2013.01); C23C 16/401 (2013.01); C23C 16/505 (2013.01); C23C 28/00 (2013.01); C23C 28/04 (2013.01); C23C 28/42 (2013.01); C23C 28/44 (2013.01); H01L 21/0234 (2013.01); H01L 21/0245 (2013.01); H01L 21/02164 (2013.01); H01L 21/02214 (2013.01); H01L 21/02274 (2013.01); H01L 21/02329 (2013.01); H01L 21/02488 (2013.01); H01L 21/02507 (2013.01); H01L 21/02532 (2013.01); H01L 21/02592 (2013.01);
Abstract

Embodiments described herein generally relate to methods of manufacturing an oxide/polysilicon (OP) stack of a 3D memory cell for memory devices, such as NAND devices. The methods generally include treatment of the oxide and/or polysilicon materials with precursors during PECVD processes to lower the dielectric constant of the oxide and reduce the resistivity of the polysilicon. In one embodiment, the oxide material is treated with octamethylcyclotetrasiloxane (OMCTS) precursor. In another embodiment, germane (GeH) is introduced to a PECVD process to form SiGefilms with dopant. In yet another embodiment, a plasma treatment process is used to nitridate the interface between layers of the OP stack. The precursors and plasma treatment may be used alone or in any combination to produce OP stacks with low dielectric constant oxide and low resistivity polysilicon.


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