The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Nov. 30, 2016
Applicants:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Centre National DE LA Recherche Scientifique—cnrs, Paris, FR;

Inventors:

Guy Feuillet, Saint-Martin D'Uriage, FR;

Michel El Khoury Maroun, Antibes, FR;

Philippe Vennegues, Antibes, FR;

Jesus Zuniga Perez, Biot, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 33/18 (2010.01); H01L 33/32 (2010.01); C30B 25/04 (2006.01); C30B 25/18 (2006.01); C30B 29/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0254 (2013.01); C30B 25/04 (2013.01); C30B 25/186 (2013.01); C30B 29/403 (2013.01); H01L 21/02381 (2013.01); H01L 21/02433 (2013.01); H01L 21/02458 (2013.01); H01L 21/02488 (2013.01); H01L 21/02639 (2013.01); H01L 21/02647 (2013.01); H01L 33/18 (2013.01); H01L 33/32 (2013.01);
Abstract

A process allowing at least one semipolar layer of nitride to be obtained, which layer is obtained from a least one among gallium, indium and aluminum on a top surface of a single-crystal layer based on silicon, wherein the process comprises the following steps: etching, from the top surface of the single-crystal layer, a plurality of parallel grooves comprising at least two opposite inclined facets, at least one of two opposite facets having a crystal orientation; masking the top surface of the single-crystal layer such that the facets having a crystal orientation are not masked; and epitaxial growth of the semipolar layer of nitride from the not masked facets; wherein the etching is carried out on a stack comprising the single-crystal layer and at least one stop layer that is surmounted by the single-crystal layer and wherein the etching etches the single-crystal layer selectively with respect to the stop layer so that the etching stops on contact with the stop layer.


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