The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Apr. 11, 2017
Applicant:

Cyntec Co., Ltd., Hsinchu, TW;

Inventors:

Chi-Hsun Lee, Taipei, TW;

Hsieh-Shen Hsieh, Changhua County, TW;

Sen-Huei Chen, Yunlin County, TW;

Assignee:

CYNTEC CO., LTD, Hsinchu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 17/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/292 (2013.01); H01F 17/04 (2013.01); H01F 27/24 (2013.01); H01F 27/28 (2013.01); H01F 27/2823 (2013.01); H01F 27/29 (2013.01);
Abstract

An inductor having a magnetic body, wherein a recess is formed in the magnetic body; a coil, formed by a conductive wire and disposed in the magnetic body, wherein a first terminal part of the conductive wire is placed on a bottom surface of the recess, wherein a first portion of the first terminal part is embedded inside the recess, wherein a second portion of the first terminal part is exposed from the magnetic body; and an electrode structure is disposed on the magnetic body, wherein a portion of the axial surface of a first end of the conductive wire is encapsulated by the magnetic body without being encapsulated by the electrode structure, and wherein at least one portion of the electrode structure is disposed over the bottom surface of the recess and in contact with the second portion of the first terminal part of the conductive wire for connecting with an external circuit.


Find Patent Forward Citations

Loading…