The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Dec. 27, 2017
Applicant:

Samsung Display Co., Ltd., Yongin-si, Gyeonggi-Do, KR;

Inventors:

Myeong-Eon Lee, Hwaseong-si, KR;

Jeong-Mo Nam, Incheon, KR;

Sangrock Yoon, Hwaseong-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Yongin-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1362 (2006.01); G02F 1/1368 (2006.01); G02F 1/1339 (2006.01); G02F 1/1333 (2006.01); G02F 1/1335 (2006.01);
U.S. Cl.
CPC ...
G02F 1/136204 (2013.01); G02F 1/1339 (2013.01); G02F 1/1368 (2013.01); G02F 1/133308 (2013.01); G02F 1/136286 (2013.01); G02F 1/133514 (2013.01); G02F 1/133528 (2013.01); G02F 2001/133314 (2013.01);
Abstract

A display apparatus includes first and second substrates, a first side sealing layer, a ground connecting part, a flexible film, a driving circuit substrate, and a backlight assembly. The first substrate includes sides extending in a first and a second direction. The second substrate is disposed opposite to the first substrate and is larger in the second direction. The second substrate includes a thin film transistor, a ground wiring and first to fourth side surfaces. The first side sealing layer is disposed on the fourth side surface. The ground connecting part is disposed on the second substrate and is electrically connected to the ground wiring and the first side sealing layer. The flexible film is connected to the second substrate. The driving circuit substrate is connected to the flexible film. The backlight assembly is disposed between the driving circuit substrate and the first substrate.


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