The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Aug. 12, 2016
Applicant:

Sharp Kabushiki Kaisha, Sakai, Osaka, JP;

Inventors:

Isao Ogasawara, Sakai, JP;

Yoshimasa Chikama, Sakai, JP;

Yoshihito Hara, Sakai, JP;

Assignee:

SHARP KABUSHIKI KAISHA, Sakai, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1339 (2006.01); G02F 1/1362 (2006.01); G06F 3/041 (2006.01); G06F 3/044 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
G02F 1/1339 (2013.01); G02F 1/136286 (2013.01); G06F 3/044 (2013.01); G06F 3/0412 (2013.01); G02F 1/13338 (2013.01); G06F 2203/04103 (2013.01);
Abstract

An active matrix substrate includes: first to third lines formed in first to third line layers, respectively, a signal different from a signal supplied to the first lines and the second lines being supplied to the third lines; first connection linesthat connect the first lines or the second lines with the first terminals; and second connection linesthat connect the third lines with the second terminals. One of two adjacent ones of the first connection lines is at least partially formed in one of the first line layer and the second line layer, and the other is at least partially formed in the other line layer. In areas that are in the sealing area and where the first connection lines and the second connection lines are superposed, the two of the first connection lines are at least partially superposed when viewed in a plan view.


Find Patent Forward Citations

Loading…