The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Apr. 17, 2018
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Toshitsugu Ishii, Gunma, JP;

Naohiro Makihira, Gunma, JP;

Hidekazu Iwasaki, Gunma, JP;

Jun Matsuhashi, Gunma, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); H01L 21/48 (2006.01); G01R 1/04 (2006.01); H01L 21/66 (2006.01); G01R 1/067 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2887 (2013.01); G01R 1/0466 (2013.01); G01R 1/0483 (2013.01); G01R 1/06722 (2013.01); G01R 31/2896 (2013.01); H01L 21/4825 (2013.01); H01L 21/4842 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 22/14 (2013.01);
Abstract

A semiconductor device is manufactured at an improved efficiency. The method of the invention includes a step of carrying out an electrical test by bringing an external terminal electrically coupled to a semiconductor chip mounted on a semiconductor device into contact with a tip portion of a probe pin coupled to a test circuit and thereby electrically coupling the semiconductor chip to the test circuit. The probe pin has a tip portion comprised of a base material, a nickel film formed thereon, and a conductive film formed thereon and made of silver. The conductive film is thicker than the nickel film.


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