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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10550295 B1

PDFFull Text
Date of Patent:
Feb. 04, 2020

Filed:

Dec. 24, 2014

Film for temporary fixing, film sheet for temporary fixing and semiconductor device

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Takahiro Tokuyasu, Tokyo, JP;

Masanori Natsukawa, Tokyo, JP;

Yasuyuki Ooyama, Tokyo, JP;

Assignee:

HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, LLP

Primary Examiner:

Frank D Ducheneaux

Int. Cl.
CPC ...
C09J 133/00 (2006.01); C09J 7/20 (2018.01); C09J 7/00 (2018.01); C09J 133/06 (2006.01); C09J 167/04 (2006.01); C09J 183/04 (2006.01); C09J 143/04 (2006.01); C08L 83/04 (2006.01); C08L 67/04 (2006.01); C08L 43/04 (2006.01); C08L 33/06 (2006.01); C08G 77/445 (2006.01); H01L 21/78 (2006.01); H01L 21/683 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
C09J 133/00 (2013.01); C08L 33/06 (2013.01); C08L 43/04 (2013.01); C08L 67/04 (2013.01); C08L 83/04 (2013.01); C09J 7/00 (2013.01); C09J 133/06 (2013.01); C09J 143/04 (2013.01); C09J 167/04 (2013.01); C09J 183/04 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 25/0657 (2013.01); C08G 77/445 (2013.01); C09J 7/20 (2018.01); C09J 2201/606 (2013.01); C09J 2201/622 (2013.01); C09J 2203/326 (2013.01); C09J 2433/00 (2013.01); C09J 2467/00 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68386 (2013.01); H01L 2224/03002 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/08146 (2013.01); H01L 2224/08155 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01); H01L 2924/35121 (2013.01);
Abstract

The film for temporary fixing of the present invention is a film for temporary fixing which is used in a processing method of a semiconductor wafer, the method including a temporary fixing step of temporarily fixing the semiconductor wafer to a support via the film for temporary fixing, a processing step of processing the semiconductor wafer that is temporarily fixed to the support, and a separation step of separating the processed semiconductor wafer from the support and the film for temporary fixing, contains (A) a high molecular weight component and (B) a silicone-modified resin, and has a modulus of elasticity of from 0.1 to 1000 MPa at 23° C. after being heated for 30 minutes at 110° C. and for 1 hour at 170° C.

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