The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2020
Filed:
Mar. 23, 2018
Future Labo Co., Ltd., Shiga, JP;
Tadashi Hashimoto, Shiga, JP;
Hisashi Hashimoto, Shiga, JP;
FUTURE LABO CO, LTD., Shiga, JP;
Abstract
A bend-open package includes a sealant without unsealing an opening until the package is bent to a predetermined bend angle or less to prevent leakage of the content in a package body. A method for manufacturing the bend-open package includes preparing a sheet member for a bend-open package, including in sequence, (a) forming cuts in the surface of a sheet base, and (b) press-bonding sealants press-cut from a sealant base to the surface of the sheet base to cover the cuts. The steps include embedding a periphery of the sealant in the surface of the sheet member by a predetermined depth, and forming a protrusion having a height smaller than a thickness of the sealant protruding outwardly from the surface of the sheet member along the entire periphery of the sealant.